Modelling and simulation of TMCPS using PMMA

In this paper, a mathematical modeling of the Touch Mode Capacitive Pressure Sensor (TMCPS) is presented and validated by using COMSOL Multiphysics simulator. The output characteristic TMCPS linearized thereby achieved mechanical coupler which utilized to convert deflection diaphragm due applied pressure into linear displacement. A square designed for conversion displacement calculate maximum capacitance sensor. 3D model design sensor built simulated simulator compare calculated values values. various factors affecting sensitivity TMCPS: physical parameters diaphragm, properties (Poisson's ratio &Young modulus), permittivity polymer, capacitor plates, gap between plates are considered validate sensitivities Poly-Methyl Methacrylate (PMMA) based with thickness 20 µm found as 0.035fF/MPa 0.034 fF/MPa respectively.